2021_22
Educational guide 
School of Engineering
A A A 
english 
Bach. Degree in Telecommunication Systems and Services Engineering (2016)
 Subjects
  INDUSTRIAL TELECOMMUNICATIONS AND ELECTROMAGNETIC COMPATIBILITY
   Contents
Topic Sub-topic
1. Design of electronic circuits.

 1.1. Introduction of electronic circuit fabrication techniques.
1.2. Models of conventional and SMD passive components (resistors, inductors, capacitors).
1.3. Layout design of electronic circuits.
2. Signal integrity.

 2.2.1. Spread in the time domain of digital pulses.
2.2.2. Effects of attenuation lines and delays.
2.2.3. Differential signals.
2.2.4. Line terminations.
2.3. Crosstalk and other interferences.
2.4. Measuring of the quality of digital signals. Diagram of the eye. Equalization.
3. Electromagnetic Compatibility

 3.1. Introduction Electromagnetic Compatibility (EMC).
3.2. Sources of interference. Couplings. Parasitic antennas. Discharges.
3.3. Characterization of EMC.
3.3.1. Regulations.
3.3.1. Probes. Conducted and radiated. Measuring instruments.
3.3.2. Probes for immunity.
3.3.3. Evaluation techniques from near field measurements.
3.4. Techniques for reducing interference.
3.4.1. Design layouts. Ground and power planes. Multilayer circuit. Rings and islands. Decoupling of feeds.
3.4.2. Shielding circuits and cables.
4. Industrial Telecomunicacions.
 4.1. Buses in automotive environments. Can Bus.
4.2. Other industrial buses.