| Competences |
| Type A | Code | Competences Specific |
| Professional | ||
| Research | ||
| AR1 | Know the design, fabrication and verification processes employed in microelectronics in general and in MEMS in particular | |
| AR4 | Evaluate different options for implementing a MEMS system and select the most appropriate according to the problem specifications | |
| AR6 | Design and implement microsystems that meet fixed specifications | |
| Type B | Code | Competences Transversal |
| Common | ||
| BC4 | Sort problems out in an effective way | |
| BC11 | Work in a team | |
| BC12 | Assertivity. Communicate clearly and with no ambiguity both to expert and non-expert audiences | |
| BC14 | Plan making and organisation | |
| Type C | Code | Competences Nuclear |
| Common | ||
| CC1 | Master the expression and comprehension of foreing languages | |
| CC2 | Use of the specific Information and communications Technology tools | |
| CC4 | Develop informational skills | |
| Learning aims |
| Objectives | Competences | ||
| To know the technological processess related to MEMS development | AR1 AR4 |
||
| To know how to combine the technological processes to achieve the desired structures | AR1 AR4 AR6 |
BC4 BC11 BC14 |
|
| To know how to describe a technological process | BC12 BC14 |
CC1 CC2 CC4 |
|
| Contents |
| Topic | Sub-topic |
| Presentation | |
| Introduction | Microsystem definition ans structure. Clean room classification. |
| Microelectronics Technology | Monocrystals obtention (wafers) Oxidation processes Doping processes Deposition processes: Physical processes (PVD) and chemical processes(CVD) Photolithographic processes Etching processes: dry etchig and wet etching |
| Hybrid Technology | The screen printing process Available inks. How to prepare a ink the drying process The firing process |
| Micromachining processes | Surface Micromachining Bulk Micromachining |
| LIGA process | Process Definition and Applications Masks Obtention Technological steps Alternative processes |
| Interconnection and packaging | "Wirebonding" Tab-Bonding Flip-Chip Wafer Bonding |
| Planning |
| Methodologies :: Tests | |||||||||
| Competences | (*) Class hours | Hours outside the classroom | (**) Total hours | ||||||
| Introductory activities |
|
1 | 0 | 1 | |||||
| Lecture |
|
25 | 50 | 75 | |||||
| Assignments |
|
4 | 17 | 21 | |||||
| Personal tuition |
|
1 | 0 | 1 | |||||
| Objective short-answer tests |
|
2 | 0 | 2 | |||||
| (*) On e-learning, hours of virtual attendance of the teacher. (**) The information in the planning table is for guidance only and does not take into account the heterogeneity of the students. | |||||||||
| Methodologies |
| Description | |
| Introductory activities | The subjects contents, learning aims and assesment procedures will be presented |
| Lecture | The contents of the subject will be analysed and discussed. |
| Assignments | Each group of students will have to define the technological processes to achieve a microsystem. The students have to prepare an inform about the sequence of technological processes and a presentation for the class. |
| Personalized attention |
|
|
| Assessment |
| Description | Weight | ||
| Assignments | The technological aspects of the work will be considered in the qualification. The presentation and correcteness of the inform and oral presentation will be considered in the qualification. |
40 % | |
| Objective short-answer tests | Two test will be performed during the semester in order to check if the students are understanding the technological processes described during the course. | 2 x 30 % | |
| Other comments and second exam session | |||
| Sources of information |
| Basic |
W. Menz, J. Mohr, O. Paul, Microsystem Technology, Wiley-VCH, 2001
Hsu, Tai-Ran, MEMS and Microsystems, McGraw-Hill, 2002 |
| Complementary |
H.J. Levinson, Principles of Lithography, SPIE press, 2005
M. Köhler, Etching in Microsystem Technology, Wiley-VCH, 1999 |
| Recommendations |
| Other comments | |
| Es recamana haver cursat Materials Electrònics, Sensors i Actuadors i Física de Semiconductors |