| Competences |
| Type A | Code | Competences Specific |
| RT1 | Have the ability to autonomously learn new techniques and to acquire suitable knowledge for conceiving, developing and exploiting telecommunication systems and services. | |
| ST3 | Ability to analyse components and their specifications for guided and non-guided communication systems. | |
| Type B | Code | Competences Transversal |
| Type C | Code | Competences Nuclear |
| Learning outcomes |
| Type A | Code | Learning outcomes |
| RT1 |
Understand the definitions, limits and regulations regarding different types of radiated and conducted interference | |
| ST3 |
Understand the concept of signal integrity and the simulation tools used to study it Understand the propagation of digital signals along transmission lines Understand the concept of crosstalk Understand the different techniques for EMIS reduction | |
| Type B | Code | Learning outcomes |
| Type C | Code | Learning outcomes |
| Contents |
| Topic | Sub-topic |
| 1. Design of electronic circuits. |
1.1. Introduction of electronic circuit fabrication techniques. 1.2. Models of conventional and SMD passive components (resistors, inductors, capacitors). 1.3. Layout design of electronic circuits. |
| 2. Signal integrity. |
2.2.1. Spread in the time domain of digital pulses. 2.2.2. Effects of attenuation lines and delays. 2.2.3. Differential signals. 2.2.4. Line terminations. 2.3. Crosstalk and other interferences. 2.4. Measuring of the quality of digital signals. Diagram of the eye. Equalization. |
| 3. Electromagnetic Compatibility |
3.1. Introduction Electromagnetic Compatibility (EMC). 3.2. Sources of interference. Couplings. Parasitic antennas. Discharges. 3.3. Characterization of EMC. 3.3.1. Regulations. 3.3.1. Probes. Conducted and radiated. Measuring instruments. 3.3.2. Probes for immunity. 3.3.3. Evaluation techniques from near field measurements. 3.4. Techniques for reducing interference. 3.4.1. Design layouts. Ground and power planes. Multilayer circuit. Rings and islands. Decoupling of feeds. 3.4.2. Shielding circuits and cables. |
| 4. Industrial Telecomunicacions. |
4.1. Buses in automotive environments. Can Bus. 4.2. Other industrial buses. |
| Planning |
| Methodologies :: Tests | ||||||||||
| Competences | (*) Class hours |
Hours outside the classroom |
(**) Total hours | |||||||
| Introductory activities |
|
1 | 0 | 1 | ||||||
| Presentations / oral communications |
|
12 | 17 | 29 | ||||||
| Laboratory practicals |
|
15 | 15 | 30 | ||||||
| Experimental integrative project |
|
2 | 10 | 12 | ||||||
| Personal attention |
|
1 | 0 | 1 | ||||||
| Extended-answer tests |
|
2 | 0 | 2 | ||||||
| (*) On e-learning, hours of virtual attendance of the teacher. (**) The information in the planning table is for guidance only and does not take into account the heterogeneity of the students. | ||||||||||
| Methodologies |
| Description | |
| Introductory activities | Presentació del curs i la seva avaluació |
| Presentations / oral communications | Explicació de la teoria i continguts del curs |
| Laboratory practicals | Realització de pràctiques i projecte de disseny de PCB |
| Experimental integrative project | |
| Personal attention | Resolució de dubtes en horaris de consulta |
| Personalized attention |
| Description |
|
Time reserved for individual attention and doubt solving with students. Due to the health emergency, this attention can be carried out through online meetings, previously appointed by e-mail, or with other online tools. |
| Assessment |
| Methodologies | Competences | Description | Weight | ||||
| Laboratory practicals |
|
Evaluation of memories of practices and works. | 40 | ||||
| Experimental integrative project |
|
Development a comprehensive project consisting of a PCB design and assembly and another works associated with the topics of the subject | 20 | ||||
| Extended-answer tests |
|
Tests on the course content | 40 | ||||
| Others |
| Other comments and second exam session | |||
|
1. As a general rule, the subject will be taught in Catalan. The documentation can be in Catalan, Spanish or English. 2. To pass the subject you must have passed all parts with a grade higher than 5 (Laboratory practices, integrative project, development tests). If there is a suspended part, they will have to go to the final exam of the second call to recover the suspended part. The final grade after passing each part with a 5 will be the weighted average of each part. 3. Practices are not recovered. The laboratory grade is the product of the practical attendance fee by the individual grade of the laboratory test. 4. Face-to-face laboratory practices will be carried out in groups of 2 or exceptionally 3 students. The selection of the group and laboratory schedule will be done through a survey at the beginning of the course in order of response to it. No other considerations will be taken into account in the choice of groups, neither academic nor work. Laboratory groups not scheduled at the beginning of the course will not be opened and there may be changes due to enrollment restrictions. 5. Online tests will not be repeated or assignments will be delayed for unjustified reasons. The deadlines for each task can be found in each task in moodle. 6. As a general rule, the use of mobile phones or other data transmission-reception systems is not permitted during the tests. 7. During the course, campus or public domain software will be used that normally works under the Windows operating system. If there are any changes to the evaluation system, they will be announced in the Moodle space of each subject at the beginning of the course or in advance. |
|||
| Sources of information |
| Basic |
A.Lázaro, R.Villarino, Telecomunicacions Industrials i Compatibilitat Electromagnètica:notes de classe , , disponible al moodle
A.Lázaro, R.Villarino, Telecomunicacions Industrials i Compatibilitat Electromagnètica: Manual de pràctiques , , disponible al moodle
Joan Pere López Veraguas, Compatibilidad electromagnética: diseño de módulos electrónicos, 2006, Marcombo
A. López, J.J. Marcuello, I. Plaza, C. Medrano, P. Ramos, A. Salinas, Compatibilidad Electromagnética. Conceptos básicos, 2007, Universidad de Zaragoza
Joan Pere Lopez Veraguas, Compatibilidad electromagnética y seguridad funcional en sistemas electronicos, 2a, 2010, Marcombo
J.Balcells, Interferencias electromagnéticas en sistemas electrónicos, 1991, Marcombo
Stephen C. Thierauf , Understanding Signal Integrity, 2011, Artech House |
||||||||
| Complementary |
M. I. Montrose, E.M. Nakauchi , Testing for EMC compliance, 2004, John Wiley & Sons
M. I. Montrose , EMC and the Printed Circuit Board: design, theory and layout made simple, 2004, John Wiley & Sons
C.R. Paul , Introduction to Electromagnetic Compatibility, 2a, 2006, John Wiley & Sons
H.W. Ott , Noise reduction techniques in electronic systems, 2a, 2008, John Wiley & Sons
H. Johnson, M. Graham, High Speed Digital Design: A Handbook of Black Magic, 1 edition (April 18, 1993), Prentice Hall
? Stephen C Thierauf , Introduction to Signal Integrity: A Laboratory Manual, Lab Manual edition (July 7, 2014), CreateSpace Independent Publishing
, , , |
||||||||
| Recommendations |